PDF Free Download | 3D and Circuit Integration of MEMS by Masayoshi Esashi
Contents of 3D and Circuit Integration of MEMS
- Part I Introduction
- Overview
- Masayoshi Esashi
- References
- Part II System on Chip
- Bulk Micromachining
- Process Basis of Bulk Micromachining Technologies
- Bulk Micromachining Based on Wafer Bonding
- SOI MEMS
- Cavity SOI Technology
- Silicon on Glass Processes: Dissolved Wafer Process (DWP)
- Single-Wafer Single-Side Processes
- Single-Crystal Reactive Etching and Metallization Process (SCREAM)
- Sacrificial Bulk Micromachining (SBM)
- Silicon on Nothing (SON)
- References
- Enhanced Bulk Micromachining Based on MIS Process
- Repeating MIS Cycle for Multilayer D structures or Multi-sensor
- Integration
- Pressure Sensors with PS Structure
- P+G Integrated Sensors
- Pressure Sensor Fabrication – From MIS Updated to TUB
- Extension of MIS Process for Various Advanced MEMS Devices
- References
- Epitaxial Poly Si Surface Micromachining
- Masayoshi Esashi
- Process Condition of Epi-poly Si
- MEMS Devices Using Epi-poly Si
- References
- Poly-SiGe Surface Micromachining
- Carrie W Low, Sergio F Almeida, Emmanuel P Quévy, and Roger T Howe
- Introduction
- SiGe Applications in IC and MEMS
- Desired SiGe Properties for MEMS
- SiGe Deposition
- Deposition Methods
- Material Properties Comparison
- Cost Analysis
- LPCVD Polycrystalline SiGe
- Vertical Furnace
- Particle Control
- Process Monitoring and Maintenance
- In-line Metrology for Film Thickness and Ge Content
- Process Space Mapping
- CMEMS® Process
- CMOS Interface Challenges
- CMEMS Process Flow
- Top Metal Module
- Plug Module
- Structural SiGe Module
- Slit Module
- Structure Module
- Spacer Module
- Electrode Module
- Pad Module
- Release
- Al–Ge Bonding for Microcaps
- Poly-SiGe Applications
- Resonator for Electronic Timing
- Nano-electro-mechanical Switches
- References
- Metal Surface Micromachining
- Minoru Sasaki
- Background of Surface Micromachining
- Static Device
- Static Structure Fixed after the Single Movement
- Dynamic Device
- MEMS Switch
- Digital Micromirror Device
- Summary
- References
- Heterogeneously Integrated Aluminum Nitride MEMS
- Resonators and Filters
- Overview of Integrated Aluminum Nitride MEMS
- Heterogeneous Integration of Aluminum Nitride MEMS Resonators with
- CMOS Circuits
- Aluminum Nitride MEMS Process Flow
- Encapsulation of Aluminum Nitride MEMS Resonators and Filters
- Redistribution Layers on Top of Encapsulated Aluminum Nitride MEMS
- Selected Individual Resonator and Filter Frequency Responses
- Flip-chip Bonding of Aluminum Nitride MEMS with CMOS
- Heterogeneously Integrated Self-Healing Filters
- Application of Statistical Element Selection (SES) to AlN MEMS Filters with CMOS Circuits
- Measurement of D Hybrid Integrated Chip Stack
- References
- MEMS Using CMOS Wafer
- Weileun Fang, Sheng-Shian Li, Yi Chiu, and Ming-Huang Li
- Introduction: CMOS MEMS Architectures and Advantages
- Process Modules for CMOS MEMS
- Process Modules for Thin Films
- Metal Sacrificial
- Oxide Sacrificial
- TiN-composite (TiN-C)
- Process Modules for the Substrate
- SF and XeF (Dry Isotropic)
- KOH and TMAH (Wet Anisotropic)
- RIE and DRIE (Front-side RIE, Backside DRIE)
- The P M CMOS Platform ( μm)
- Accelerometer
- Pressure Sensor
- Resonators
- The P M CMOS Platform ( μm)
- Tactile Sensors
- IR Sensor
- Resonators
- Others
- CMOS MEMS with Add-on Materials
- Gas and Humidity Sensors
- Metal Oxide
- Polymer
- Biochemical Sensors
- Pressure and Acoustic Sensors
- Microfluidic Structures
- Monolithic Integration of Circuits and Sensors
- Multi-sensor Integration
- Gas Sensors
- Physical Sensors
- Readout Circuit Integration
- Resistive Sensors
- Capacitive Sensors
- Inductive Sensors
- Resonant Sensors
- Issues and Concerns
- Residual Stresses, CTE Mismatch, and Creep of Thin Films
- Initial Deformation – Residual Stress
- Thermal Deformation – Thermal Expansion Coefficient Mismatch
- Long-time Stability – Creep
- Quality Factor, Materials Loss, and Temperature Stability
- Anchor Loss
- Thermoelastic Damping (TED)
- Material and Interface Loss
- Dielectric Charging
- Nonlinearity and Phase Noise in Oscillators
- Concluding Remarks
- References
- Wafer Transfer
- Introduction
- Film Transfer
- Device Transfer (via-last)
- Device Transfer (Via-First)
- Chip Level Transfer
- References
- Piezoelectric MEMS
- T Takeshi Kobayashi (AIST)
- Introduction
- Fundamental
- PZT Thin Films Property as an Actuator
- PZT Thin Film Composition and Orientation
- PZT Thin Film Deposition
- Sputtering
- Sol–Gel
- Orientation Control
- Thick Film Deposition
- Electrode Materials and Lifetime of PZT Thin Films
- PZT–MEMS Fabrication Process
- Cantilever and Microscanner Poling
- References
- Part III Bonding, Sealing and Interconnection
- Anodic Bonding
- Masayoshi Esashi
- Principle
- Distortion
- Influence of Anodic Bonding to Circuits
- Anodic Bonding with Various Materials, Structures and Conditions
- Various Combinations
- Anodic Bonding with Intermediate Thin Films
- Variation of Anodic Bonding
- Glass Reflow Process
- References
- Direct Bonding
- Hideki Takagi
- Wafer Direct Bonding
- Hydrophilic Wafer Bonding
- Surface Activated Bonding at Room Temperature
- References
- Metal Bonding
- Solid Liquid Interdiffusion Bonding (SLID)
- Au/In and Cu/In
- Au/Ga and Cu/Ga
- Au/Sn and Cu/Sn
- Void Formation
- Metal Thermocompression Bonding
- Interface Formation
- Grain Reorientation
- Grain Growth
- Eutectic Bonding
- Au/Si
- Al/Ge
- Au/Sn
- References
- Reactive Bonding
- Motivation
- Fundamentals of Reactive Bonding
- Material Systems
- State of the Art
- Deposition Concepts of Reactive Material Systems
- Physical Vapor Deposition
- Conclusion Physical Vapor Deposition and Patterning
- Electrochemical Deposition of Reactive Material Systems
- Dual Bath Technology
- Single Bath Technology
- Conclusion DBT and SBT
- Vertical Reactive Material Systems With D Periodicity
- Dimensioning
- Fabrication
- Conclusion
- Bonding With RMS
- Conclusion
- References
- Polymer Bonding
- Introduction
- Materials for Polymer Wafer Bonding
- Polymer Adhesion Mechanisms
- Properties of Polymers for Wafer Bonding
- Polymers Used in Wafer Bonding
- Polymer Wafer Bonding Technology
- Process Parameters in Polymer Wafer Bonding
- Localized Polymer Wafer Bonding
- Precise Wafer-to-Wafer Alignment in Polymer Wafer Bonding
- Practical Examples of Polymer Wafer Bonding Processes
- Summary and Conclusions
- References
- Soldering by Local Heating
- Soldering in MEMS Packaging
- Laser Soldering
- Resistive Heating and Soldering
- Inductive Heating and Soldering
- Other Localized Soldering Processes
- Self-propagative Reaction Heating
- Ultrasonic Frictional Heating
- References
- Packaging, Sealing, and Interconnection
- Wafer Level Packaging
- Sealing
- Reaction Sealing
- Deposition Sealing (Shell Packaging)
- Metal Compression Sealing
- Interconnection
- Vertical Feedthrough Interconnection
- Through Glass via (TGV) Interconnection
- Through Si via (TSiV) Interconnection
- Lateral Feedthrough Interconnection
- Interconnection by Electroplating
- References
- Vacuum Packaging
- Problems of Vacuum Packaging
- Vacuum Packaging by Anodic Bonding
- Packaging by Anodic Bonding with Controlled Cavity Pressure
- Vacuum Packaging by Metal Bonding
- Vacuum Packaging by Deposition
- Hermeticity Testing
- References
- Buried Channels in Monolithic Si
- Buried Channel/Cavity in LSI and MEMS
- Monolithic SON Technology and Related Technologies
- Applications of SON
- References
- Through-substrate Vias
- Configurations of TSVs
- Solid TSVs
- Hollow TSVs
- Air-gap TSVs
- TSV Applications in MEMS
- Signal Conduction to the Wafer Backside
- CMOS-MEMS D Integration
- MEMS and CMOS D Integration
- Wafer-level Vacuum Packaging
- Other Applications
- Considerations for TSV in MEMS
- Fundamental TSV Fabrication Technologies
- Deep Hole Etching
- Deep Reactive Ion Etching
- Laser Ablation
- Insulator Formation
- Silicon Dioxide Insulators
- Polymer Insulators
- Air-gaps
- Conductor Formation
- Polysilicon
- Single Crystalline Silicon
- Tungsten
- Copper
- Other Conductor Materials
- Polysilicon TSVs
- Solid Polysilicon TSVs
- Air-gap Polysilicon TSVs
- Silicon TSVs
- Solid Silicon TSVs
- Air-gap Silicon TSVs
- Metal TSVs
- Solid Metal TSVs
- Hollow Metal TSVs
- Air-gap Metal TSVs
