Adhesion in Microelectronics by K.L. Mittal, and Tanweer Ahsan

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Adhesion in Microelectronics by Mittal and Ahsan

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Contents of Adhesion in Microelectronics eBook

  • Part 1: Adhesion: Fundamentals and Measurement
  • Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics
  • Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
  • Part 2: Ways to Promote/Enhance Adhesion
  • Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion
  • Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging
  • Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
  • Part 3: Reliability and Failure Mechanisms
  • Role of Adhesion Phenomenon in the Reliability of Electronic Packaging
  • Delamination and Reliability Issues in Packaged Devices
  • Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages

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