PDF Free Download | Adhesion in Microelectronics by K.L. Mittal, and Tanweer Ahsan
Contents of Adhesion in Microelectronics eBook
- Part 1: Adhesion: Fundamentals and Measurement
- Study of Molecular Bonding or Adhesion by Inelastic Electron Tunneling Spectroscopy, with Special Reference to Microelectronics
- Adhesion Measurement of Thin Films and Coatings: Relevance to Microelectronics
- Part 2: Ways to Promote/Enhance Adhesion
- Tailoring of Interface/Interphase to Promote Metal-Polymer Adhesion
- Atmospheric and Vacuum Plasma Treatments of Polymer Surfaces for Enhanced Adhesion in Microelectronics Packaging
- Isotropic Conductive Adhesive Interconnect Technology in Electronics Packaging Applications
- Part 3: Reliability and Failure Mechanisms
- Role of Adhesion Phenomenon in the Reliability of Electronic Packaging
- Delamination and Reliability Issues in Packaged Devices
- Investigation of the Mechanisms of Adhesion and Failure in Microelectronic Packages
