Electrical Connectors Design Manufacture Test and Selection
Contents of Electrical Connectors Design Manufacture Test and Selection
- What Is an Electrical Connector?
- Michael G Pecht and San Kyeong
- Challenges of Separable Connectors
- Components of a Connector
- Contact Springs
- Contact Finishes
- Noble Metal Contact Finishes
- Non-noble Metal Contact Finishes
- Connector Housing
- Contact Interface
- Connector Types
- Board-to-Board Connectors
- Wire/Cable-to-Wire/Cable Connectors
- Wire/Cable-to-Board Connectors
- Connector Terminology
- References
- Connector Housing
- Michael G Pecht
- Mechanical Properties
- Electrical Properties
- Flammability
- Temperature Rating
- Housing Materials
- Thermoplastic Polymers
- Polyesters
- Polyimides, Polyamide-imides, and Polyetherimides
- Polyphenylene Sulfides
- Polyether Ether Ketones
- Liquid-Crystalline Polymers
- Comparison ofThermoplastic Polymers
- Thermosetting Polymers
- Additives to Housing Materials
- Manufacturing of Housing Materials
- References
- Contact Spring
- Michael G Pecht
- Copper Alloys
- Unified Number System (UNS)
- Properties of Copper Alloys
- Nickel Alloys
- Conductive Elastomers
- ContactManufacturing
- References
- Contact Plating
- Michael G Pecht
- Noble Metal Plating
- Gold
- Palladium
- Combination of Gold and Palladium
- Non-noble Metal Plating
- Silver
- Characteristics of Silver as a Contact Finish
- Potential Tarnish-Accelerating Factors
- Use of Silver in Typical Connectors
- Managing Silver Corrosion
- Silver-Palladium Alloys
- Nanocrystalline Silver Alloys
- Silver-Bismuth Alloys Tin
- Nickel Contact Finishes
- Underplating
- Plating Process
- Electrolytic Plating
- Rack Plating
- Barrel Plating
- Electroless Plating
- Cladding
- Hot Dipping
- References
- Insertion and Extraction Forces
- Michael G Pecht
- Insertion and Extraction Forces
- Contact Retention
- Contact Force and Deflection
- Contact Wipe
- References
- Contact Interface
- Michael G Pecht and San Kyeong
- Constriction Resistance
- Contact Resistance
- Other Factors Affecting Contact Resistance
- Current Rating
- Capacitance and Inductance
- Bandpass and Bandwidth
- References
- The Back-End Connection
- Chien-Ming Huang, San Kyeong and Michael G Pecht
- Soldered Connection
- Press-Fit Connection
- Crimping Connection
- Insulation Displacement Connection
- References
- Loads and Failure Mechanisms
- San Kyeong, Lovlesh Kaushik andMichael G Pecht
- Environmental Loads
- Temperature
- Vibration Load
- Humidity
- Contamination
- Differential Pressure
- Failure Mechanisms in Electrical Connectors
- Silver Migration
- Tin Whiskers
- Corrosion Failure
- Dry Corrosion
- Galvanic Corrosion
- Pore Corrosion
- Creep Corrosion
- Fretting Corrosion
- Arc Formation
- Creep Failure
- Wear
- Frictional Polymerization
- Case Study by NASA: Electrical Connectors for Spacecraft
- References
- Fretting in Connectors
- Deepak Bondre andMichael G Pecht
- Mechanisms of Fretting Failure
- Material Factors That Affect Fretting
- Contact Materials
- Hardness
- Surface Finish
- Frictional Polymerization
- Grain Size
- Oxides
- Coefficient of Friction
- Electrochemical Factor
- Operating FactorsThat Affect Fretting
- Contact Load
- Fretting Frequency
- Slip Amplitude
- Electric Current
- Environmental FactorsThat Affect Fretting
- Humidity
- Temperature
- Dust
- Reducing the Damage of Fretting
- Lubrication
- Improvement in Design
- Coatings
- References
- Testing
- Dielectric With standing Voltage Testing
- Insulation Resistance Testing
- Contact Resistance Testing
- Current Rating
- Electromagnetic Interference and Electromagnetic Compatibility
- Testing
- Temperature Life Testing
- Thermal Cycling Testing
- Thermal Shock Testing
- Steady-State Humidity Testing
- Temperature Cycling with Humidity Testing
- Corrosion
- Dry Corrosion
- Creep Corrosion
- Moist Corrosion
- Fretting Corrosion
- Mixed Flowing Gas Testing
- Battelle Labs MFG Test Methods
- EIA MFG Test Methods: EIA -TP A
- IEC MFG Test Methods: IEC – – Part
- Telcordia MFG Test Methods: Telcordia GR- -CORE Section
- IBM MFG Test Methods: G (T)
- CALCE MFG Chamber Capability
- Vibration
- Mechanical Shock
- Mating Durability
- Highly Accelerated Life Testing
- Environmental Stress Screening
- References
- Supplier Selection
- Connector Reliability
- Capability MaturityModels
- Key Reliability Practices
- Reliability Requirements and Planning
- Training and Development
- Reliability Analysis
- Reliability Testing
- Supply-Chain Management
- Failure Data Tracking and Analysis
- Verification and Validation
- Reliability Improvement
- Reliability Capability of an Organization
- The Evaluation Process
- References
- Selecting the Right Connector
- Connector Requirements Based on Design and Targeted Application
- Mating Cycles
- Current and Power Ratings
- Environmental Conditions
- Termination Types
- Materials
- Connector Housing Materials
- Connector Spring Materials
- Contact Finishes
- Reliability
- Raw Cables and Assemblies
- Supplier Reliability Capability Maturity
- Connector Selection Team
- Selection of Candidate Parts from a Preferred Parts Database
- Electronic Product Manufacturers’ Parts Databases
- Parts Procurement
- Parts Availability
- High-Speed Connector Selection
- NASA Connector Selection
- Harsh Environment Connector Selection
- Fiber-Optic Interconnect Requirements by Market
- High-Power Subsea Connector Selection
- Undersea Connector Reliability
- Screening Tests
- Low-Voltage Automotive Single- and Multiple-Pole Connector
- Validation
- Failure Modes, Mechanisms, and Effects Analysis for Connectors
- Connector Experiments
- Summary
- References
- Signal Connector Selection
- Issues Involving High-Speed Connectors
- Signal Transmission Quality Considerations
- Interconnect Delays
- Signal Distortion
- Electromagnetic Compatibility
- Virtual Prototyping
- TDR Impedance Measurements
- Reflection Coefficient
- TDR Resolution Factors
- TDR Accuracy Factors
- Vector Network Analyzer
- Simulation Program with Integrated Circuit Emphasis (SPICE)
- References
- Advanced Technology Attachment Connectors
- Neda Shafiei, Kyle LoGiudice andMichael G Pecht
- ATA Connector and SATA Connector Overview
- History of ATA and SATA
- Physical Description of ATA Connectors, ATA Alternative Connectors, and
- SATA Connectors
- ATA Standardization and Revisions
- SATA Standardization and Revisions
- SATA in the Future
- References
- Power Connectors
- Michael G Pecht and San Kyeong
- Requirements for Power Connectors
- Power Connector Materials
- Types of Power Connectors
- Power Contact Resistance
- Continuous, Transient, and Overload Current Capacities
- Continuous Current Capacity
- Transient Current Capacity
- Overload Current Capacity
- Current Rating Method
- References
- Electrical Connectors for Underwater Applications
- Flore Remouit, Jens Engström and Pablo Ruiz-Minguela
- Background and Terminology
- History
- Terminology
- Commercial Off-the-Shelf (COTS) Connectors
- Rubber-Molded
- Rigid-Shell or Bulkhead Assemblies
- Fluid-Filled Underwater Mateable
- Inductive Coupling
- Assemblies (Non-unmateable)
- Connector Design
- Thermal Design
- Electrical Properties
- Mechanical Properties
- Material Choices
- Specifications for Underwater Connectors
- Connector Deployment and Operation
- Connection Procedure
- Connection Layout
- Reliability
- Discussion and Conclusion
- References
- Examples of Connectors
- Lei Su, Xiaonan Yu, San Kyeong andMichael G Pecht
- Amphenol ICC M-SeriesTM Connectors
- Amphenol ICC Paladin®Connectors
- Amphenol ICC W EnergyEdgeTM X-treme Card Edge Series
- Amphenol ICC FLTStack Connectors
- Amphenol ICC HSBridge Connector System
- Amphenol ICC MUSBR Series USB Type-A Connectors
- Amphenol ICCWaterproof USB Type-CTM Connectors
- Amphenol ICC NETBridgeTM Connectors
- Amphenol Sine Systems DuraMateTM AHDP Circular Connectors
- Amphenol Aerospace MIL-DTL- Series III Connectors
- Fischer Connectors UltiMateTM Series Connectors
- Hirose Electric DF Series Connectors
- Hirose Electric microSDTM Card Connectors
- Molex SAS- and U (SFF- ) Backplane Connectors
- Molex NeoPressTM Mezzanine Connectors
- Molex ImpelTM Plus Backplane Connectors
- Molex EXTreme GuardianTM Power Connectors
- Molex ImperiumTM High Voltage/High Current Connectors
- TE Connectivity Free Height Connectors
- TE Connectivity STRADA Whisper Connectors
- TE Connectivity MULTI-BEAM High-Density (HD) Connectors
- TE Connectivity HDMITM Connectors
- TE Connectivity AMP CT Connector Series
- TE Connectivity Micro Motor Connectors
- TE Connectivity AMPSEAL Connectors
- TE Connectivity M X-Code Connectors
- TE Connectivity SOLARLOK Connectors
- TE Connectivity Busbar Connectors
- References
- Appendix
- Standards
- A Standard References for Quality Management and Assurance
- A General Specifications for Connectors
- A Safety-Related Standards and Specifications
- A Standard References for Connector Manufacturing
- A Standard References for Socket Material Property Characterization
- A Standard References for Socket Performance Qualification
- A Standard References for Socket Reliability Qualification
- A Other Standards and Specifications
- A Telcordia
- A Society of Cable Telecommunications Engineers (SCTE)
- A Electronic Industries Alliance/Telecommunications Industry Association
- (EIA/TIA)
- A International Electrotechnical Commission (IEC)
- A IEC Standards
- A IEC Connectors
- A Military Standards (MIL-STD)
- A Standards for Space-Grade Connectors
- References
